Pioneer Probe Pins Technology
Co., Ltd.
先鋒探針科技股份有限公司

Discover Our Cutting-Edge AI-Driven Probing Technology

We Are Visionaries

Using advanced materials and cutting-edge micro-machining processes, we drive the development of next-generation components for GPUs, CPUs, silicon photonics, and medical devices. We provide innovative probe pins and high-precision socket solutions.

Femto-Second LaserTurning can fabricate complex Micron-sized Probe Pins with ultra-high precision, as well as drill SQUARE(or round) shaped holes for guide plates of Sockets.

Research & Technology

Silicon Photonics、TGV 、HPC、6G RF and Ultra High Bandwidth Chip Testing all require finer pitch of probe pins and socket fabrications solutions in testing and packaging industries.

With a strong focus on R&D, we leverage advanced materials like Al-SiC, SiC, SiN, and semi-ceramics, and cutting-edge micro-machining processes such as femtosecond lasers, lithography, and electroforming. Our expertise drives the development of next-generation components for GPUs, CPUs, silicon photonics, and medical devices, including human body navigation systems and surgical equipment.

Hi Performance Computing(HPC)

High Speed, High Bandwidth, High Performance , Low Inductance Chip Probing

Large I/O, High Bandwidth, 112G + PAM4

Patented Braided Low profile, with Dia.< 0.3mm & low inductance Probe pin - ideal contacting solution for testing of mobile communications, High speed digital/analog devices(BGA / LGA/QFN) packages with pitches down to 0.35mm)

Burn-in & Reliability Tests

Unique One-Body design by press molding ensures ultra-low electrical resistance(below 20 mΩ) with actuation force less than 20 gram/pin.

Dia.< 0.25mm , length < 2.5mm By beryllium copper or Palladium alloy

Patented stamped pins ensures good yield rate, high electrical performance, low test subject damages and less dirt accumulation with lower costs for purchasing.

Advanced Conceptual Products

For WLCSP（Wafer Level Chip Scale Packaging）and Emerging AI driven Testing Needs, we can make pogo pin plungers with Dia. smaller than 30µm and fabricate square Probe pins as small as 40µm x 40 µm with Ceramic sockets holes of Aspect Ration greater than 1:20.

Square holes for TGV Interposer of AR> 1:20, Pure-Dry None-Litho CP pins

Guide plate made of PI Film, SiC, Al-AiC, SiN or Engineering Polymer Plastics like PEEK can all be processed by State-of-the-Art Femto-second Laser as well as New Gen. Sub-Micron One-Body Pogo Pins. Precision Parts of Human body Navigation/Treatment system like da Vinci Surgical Machines and Fiber Optic connector Chip modules on of Silicon Photonic Applications

What We Stand For

Innovation, Human Connection, and Cross-Industry Integration.

Following ESG trends, we utilize high-precision femtosecond laser with AI positioning instead of water-intensive photolithography. With expertise in CNC, metal stamping, and die-cutting, we provide cost-effective solutions from ICT to semiconductor packaging, including 5-layer metal foil development at 1.76 µm.

Johnny Liu
CEO and Co-Founder of Pioneer